PCB & PCB Assembly factory

Welcome to visit our workshop

14-Year PCB Factory

14-Year PCB Factory

factory

PCB Production Capacity:15,000㎡

PCB Production Capacity:15,000㎡

400+ workers

400+ workers

Our company, established in 2011, operates three specialized manufacturing facilities. We offer strong monthly production capacity, including 15,000 m² of PCBs, 8,000 m² of flexible PCBs, and 10,000 assembled units.

We offer a wide range of PCB solutions, from double-sided boards to 30-layer multilayer PCBs. Our capabilities include standard FR-4 boards, mid- to high-TG PCBs, flexible PCBs, rigid-flex boards, metal-core PCBs, thick copper boards, and high-frequency PCBs using materials such as Rogers, F4BM, and PTFE. We also support ultra-thin, ultra-thick, and halogen-free PCB options.

In terms of specialized fabrication processes, we provide capabilities including half-hole processing, board bonding, precise impedance control, metal edging treatment, resin via plugging, blue glue application, carbon ink printing, gold finger plating, blind milling, blind and buried via formation, and countersunk hole machining. For surface finish solutions, our offerings cover ENIG (electroless nickel immersion gold), HASL (hot air solder leveling), OSP (organic solderability preservative), ENEPIG (electroless nickel/immersion palladium/immersion gold), heavy gold plating, gold fingers, immersion silver, immersion tin, and the combined ENIG+OSP finish.

We have obtained multiple certifications, including ISO9001, ISO14001, ISO13485, IATF16949, CQC, and UL (United States and Canada).

WORKSHOP

dust-free workshop

Processing Processing Area

Reflow Oven

SMT Workshop

AOI Checking

OSP

Our workers

Production Lines

Step into our Production Lines

factory - PCBAndAssembly
PCB Factory
factory - PCBAndAssembly
factory - PCBAndAssembly
Factory - PCBAndAssembly

Our equipment

Quality Inspection

We have a complete quality inspection system to ensure that the products we produce are up to standard.

To prevent process defects caused by poor materials online, and time loss caused by substandard refurbished materials.

pcb and assembly
pcb and assembly
Step Two:SPI solder paste testing

To detect defective solder paste printing products in advance and avoid them flowing into the next process.

To check whether the produced products have any errors, omissions, or defective materials flowing out of the next process.

AOI
PCB and Assembly
Step Four: SMI First Article Inspection

To confirm the correctness of the assembly process on the production line and ensure that the parameters of each resistive and capacitive component are within the standard range.

Conduct spot checks on all production processes to ensure compliance with the work instructions.

Step Six:Offline AOI detection

To test according to the IPC610D standard, and to check for defects such as errors, omissions, and false connections in the surface mounted PCBA after welding.

To test the solder joints of components that are not visible to the naked eye, ensuring the reliability of each solder ball in BGA.

bga x ray inspection
pcb and assembly
Step Eight:QC manual inspection

According to the IPC-610 inspection standard, inspect the finished board to ensure 99.98% of good products are shipped.

Strictly inspect before shipment and scan the code for verification to prevent unqualified products from being shipped.

PCB and Assembly