Custom Flexible PCB Manufacturing
Flex PCB Manufactur
Rapid Prototype & Volume Flex PCB Fabrication Services
we specialize in high-quality flex circuit manufacturing—from rapid-turn prototyping to full-volume flexible PCB fabrication. Upload your Gerber files now for a fast, reliable quote.
- Single-sided to multilayer flex
- Polyimide substrates
- Coverlay and stiffener options
- 99.9%
- Customer Satisfaction Rate
- 120+
- Countries
- 6000+
- Annual Ordering Customers
- 98.15%
- On-Time Delivery Rate
What Is a Flex PCB?
A flex PCB is a printed circuit board built on a flexible substrate, usually polyimide. It allows circuits to fit into compact spaces and follow a product’s shape, helping reduce the need for separate wires and connectors.
Some flex circuits bend only during installation; others are designed for repeated movement. The materials, stack-up and bend geometry must match the intended use.
Our Core Advantages in Flex PCB Manufacturing
As a professional Flex PCB manufacturer, we combine advanced engineering, high-precision fabrication, and responsive customer support to deliver reliable and customized flexible circuit solutions. Here’s what sets us apart:
Flex Circuit Types We Manufacture
Choose a single-sided, double-sided or multilayer construction according to your routing needs. The layer structure and bending requirements determine which option fits your design.
Single-Sided Flex
One copper layer for straightforward routing and low-profile interconnects.
Double-Sided Flex
Two copper layers with plated connections for circuits that need routing on both sides.
Multilayer Flex
Multiple copper layers for more complex routing. Stack-up and bend areas must be evaluated together.
A flex-to-install circuit bends during installation. A dynamic flex circuit bends repeatedly in use and needs an application-specific material and fatigue assessment.
Our Flex PCB Manufacturing Capabilities
| Feature | Capability |
|---|---|
| Layer count | 1–8 layers |
| Base material | Polyimide (PI); DuPont and Shengyi options |
| Board dimensions | 6 × 6 mm to 406 × 610 mm |
| Board thickness | 0.1–0.8 mm; specify the flex area and local stiffened thickness separately |
| Finished copper weight | 0.5–2 oz |
| Minimum trace / space | 3 / 3 mil (approximately 0.076 / 0.076 mm), subject to copper weight and stack-up |
| Minimum drill diameter | 8 mil (approximately 0.20 mm); finished-hole requirements reviewed separately |
| Order quantity | Prototypes from 1 piece through production orders of 10,000+ pieces |
| Stiffeners | PI and FR4 |
| Surface finishes | ENIG, OSP, immersion tin and HASL options, subject to design suitability |
| Controlled impedance | Available; specify target impedance, tolerance and stack-up |
Stiffener Integration
We integrate FR4 stiffeners from 0.075 to 3.2 mm and polyimide stiffeners from 0.025 to 0.225 mm, with adhesive widths controlled to 1.5 ± 0.5 mm and minimum copper clearance of 0.3 mm.
On high-cycle flex designs, these are commonly used for ZIF connectors, edge contacts, and mechanical reinforcement zones.
Stiffener design and placement follow IPC-2223 guidelines for mechanical reinforcement and pad stability in dynamic flex zones.
Surface Finishes & Solderability
We offer ENIG, Lead-Free HASL, OSP, Immersion Tin, and Immersion Silver finishes for all flex PCB builds. Surface treatments are applied to exposed copper for solderability, oxidation resistance, and electrical contact durability.
ENIG is preferred for high-density designs and gold finger edge connections; OSP is ideal for prototype runs and flat SMT pads. Selective finish combinations such as ENIG + OSP are available for mixed-performance zones.
Peelable mask can be combined with coverlay for selective solder areas, ZIF connectors, or rework zones. All finishes conform to IPC-455x series standards for surface coatings and meet RoHS-compliant lead-free assembly requirements.
Impedance Control & Signal Integrity
All flexible printed circuit boards can be manufactured with impedance control:
- Single-ended: ± 5 Ω (≤50 Ω), ±10% (>50 Ω)
- Advanced builds: ± 3 Ω (≤50 Ω), ±8% (>50 Ω)
These tolerances (as precise as ±3 Ω) are validated through TDR testing and reflect industry-leading control for RF, sensor, and high-speed signal designs. For controlled impedance in RF, medical, and sensor applications.
Materials, Coverlay and Stiffener Options
Define the flexible stack-up and reinforced areas together. Material selection affects thickness, bending behaviour, connector fit and soldering requirements.
Polyimide Base
Specify the required laminate grade and dielectric thickness. DuPont and Shengyi PI options can be evaluated against your build requirements.
Copper Selection
Rolled-annealed and electrodeposited copper have different mechanical properties. Identify repeated bending requirements before selecting the foil and copper weight.
Coverlay
Define the protected circuit areas and pad openings. Coverlay thickness and registration affect exposed-pad clearance and the finished stack-up.
PI and FR4 Stiffeners
Add local support at connectors or mounting areas. Specify stiffener thickness, location, adhesive and the required finished connector thickness.
Surface Finish
Select a finish for the exposed pads based on contact, soldering and flatness requirements. ENIG, OSP and immersion tin are among the available options.
Flex PCB Design and Manufacturability Guidelines
Practical design considerations for reliable flex PCB fabrication.
Bend Radius and Flexibility
- Static flexing: Reference minimum bend radius = 10× finished flex thickness for 1–2 copper layers; 20× for multilayer flex.
- Dynamic flexing: Reference minimum bend radius = 100× finished flex thickness for 1 copper layer; 150× for 2 layers.
- Use RA copper for repeated bending; keep vias and solder joints outside the bend zone.
Trace Routing Techniques
- Route traces at 90° to the bend axis where possible.
- Use curved corners and gradual changes in trace width.
- Stagger traces on opposite layers in bending areas.
- Use teardrops at pad connections; maintain consistent geometry for controlled impedance.
Layer Stack-Up and Construction
- Choose single-sided, double-sided or multilayer flex to suit the circuit.
- Prefer 1–2 copper layers for dynamic flexing; avoid multilayer constructions in repeated-bend areas.
- Balance multilayer constructions and confirm the finished flex thickness.
- Add stiffeners where connectors or mounting points need support.
Pad, Via, and Component Placement
- Keep pads, vias and components away from active bend areas.
- Use generous annular rings and teardrops at via connections.
- Allow for coverlay registration and adhesive squeeze-out around exposed pads.
- Support connector and component areas with suitable stiffeners.
Material Selection
- Use polyimide (PI) for flexible, heat-resistant substrates.
- Choose rolled-annealed (RA) copper for dynamic flex applications.
- Consider adhesiveless laminates to reduce flex thickness.
- Specify PI or FR4 stiffeners; match finished ZIF tail thickness to the connector.
Panelization and Tooling Considerations
- Plan panel rails and support for handling thin flex circuits.
- Agree tooling holes and fiducials with the manufacturing process.
- Keep breakaway tabs clear of contacts and critical bend regions.
- Confirm the panel layout and outline tolerances before fabrication.
Inspection for Your Flex PCB Build
Flex PCB inspection needs to address circuit integrity and mechanical details. Define the acceptance criteria and any additional test or documentation requirements with your manufacturing enquiry.
Circuit Inspection
AOI checks circuit features, while electrical testing checks continuity and isolation against the board data.
Mechanical Checks
Inspection points include board outline, coverlay openings and stiffener position, with connector thickness assessed against the drawing.
Project-Specific Testing
For controlled-impedance or repeated-flexing designs, specify the required test method, acceptance limits and reporting needs before production.
Applications for Flexible Printed Circuits
Flex circuits are used where conventional rigid boards or wiring are difficult to fit. Each application sets its own requirements for movement, operating conditions and reliability.
Compact Consumer Devices
Thin interconnects between displays, cameras, controls and other tightly packaged modules.
Medical Electronics
Compact connections in monitoring and instrumentation, with materials and validation defined by the device requirements.
Industrial Sensors and Equipment
Signal routing through restricted spaces, with installation bends or repeated motion specified separately.
Communication Modules
Compact interconnects where stack-up, reference layers and signal requirements need careful coordination.
How to Order Your Flex PCB
-
Submit Your Files
Send Gerber and drill files, a fabrication drawing, stack-up requirements, quantity and target delivery date.
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Review the Requirements
Clarify materials, bend areas, stiffeners, finishes and any special acceptance criteria with our team.
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Confirm the Quote
Agree the manufacturing specification, price and delivery schedule before releasing the order.
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Manufacture and Inspect
Boards proceed through fabrication and the agreed inspection requirements before shipment.
Flex PCB Manufacturing FAQs
What is the Cost of Flexible PCBs?
Our published guide is $0.50–$5.00 per square inch for standard designs and materials, not a fixed quote. Layer count, board size, materials, stiffeners and quantity affect the final price. Send your Gerber files and quantity for a project quote.
How can I reduce flex PCB cost?
Use fewer copper layers where the circuit allows, reduce board area and improve panel utilisation. Specify controlled impedance only on nets that need it, and compare prototype and production quantities. Keep the materials and copper thickness needed for your bend life and current requirements.
How long does manufacturing take?
Published supplier benchmarks are 3–7 business days for prototypes and 7–20 business days for production. Use these for planning, not as our delivery commitment. Request a confirmed manufacturing lead time with your files and quantity, and allow separately for shipping.
What bend radius should I use?
Using the finished flex thickness t, Multi-CB references 10×t for static 1–2-layer flex and 20×t for static multilayer flex; dynamic references are 100×t for one copper layer and 150×t for two. A 0.10 mm single-layer flex therefore starts at 1 mm static or 10 mm dynamic. Confirm against your stack-up and bend life; see the design guidelines.
When is a stiffener needed?
Add a stiffener where the flex needs local support: ZIF connector tails, soldered connectors, component areas or mounting points. PI can build up a connector tail to its specified thickness; FR4 provides more rigid support. Include adhesive in the finished thickness and keep stiffeners outside the active bend area.
How is flex PCB different from rigid-flex?
Flex PCB uses a flexible circuit substrate; an added stiffener provides mechanical support without adding routed rigid circuit layers. Rigid-flex integrates rigid and flexible circuit sections into one board. Choose flex for flexible interconnects; consider rigid-flex when rigid component sections must connect through flexible regions.
Can I order prototypes before production?
Yes—prototype orders start from 1 piece. Submit Gerber and drill files, your stack-up, stiffener requirements and quantity. Use the prototype to check fit, connector insertion and bending before releasing production; include the expected production quantity when requesting your quote.
