Rogers PCB Manufacturing for High-Frequency Signal Integrity

Low-loss Rogers laminates, controlled impedance and engineered stack-ups for RF, microwave, antenna and high-speed digital applications.

  • Rogers & PTFE Materials

  • Controlled Impedance
  • Hybrid Stack-ups
  • Prototype to Production

Get You Quote!

What is Rogers PCB?

Rogers PCBs are printed circuit boards made from engineered Rogers circuit board material, specifically designed to minimize dielectric loss, support high-frequency operation, and provide stable electrical performance across a wide frequency range. OrinewPCB fabricates Rogers printed circuit boards to deliver superior performance for your most demanding applications.

  • Rogers PCB fabrication with low-loss, low-moisture absorption substrates.
  • Rogers material support for RF, radio frequency, and high-speed digital circuits.
  • Tight DK and DF control with IPC-compliant performance and streamlined properties over traditional PCB materials.
Rogers PCB

Choose the Substrate Around
Your Signal, Not a Generic Material List

FR-4 remains practical for many standard digital circuits. Rogers becomes relevant when dielectric loss, Dk stability, controlled impedance, moisture behavior or thermal cycling drives the design.

01

Frequency and
Signal Path

Standard digital /
RF / Microwave /
Antenna

02

Loss Budget

Insertion loss /
signal margin /
dielectric loss

03

Construction

All-Rogers /
Rogers + FR-4
hybrid

Types of Rogers PCB Materials

Metal Claddings

Metal Claddings

  • Rolled
  • Electrodeposited
  • Electrodeposited Reverse Treated
  • Resistive Foil
Bonding Materials

Bonding Materials

  • Ceramic PTFE Bondply
  • Woven Glass
  • Prepreg
  • Hydrocarbon
  • Thermoset Thermal and Electrically Conductive Adhesive (TECA) Film
Laminates

Laminates

  • Woven Glass Reinforced Modified Epoxy Laminates
  • PTFE Random Glass Fiber
  • Woven Glass UL 94 V-0 laminates
  • Hydrocarbon
  • PTFE Ceramic
  • Cross-Plied Woven Glass-Reinforced PTFE
  • Woven Glass Reinforced PTFE Antenna Grade Laminates
  • Filled PTFE Composite
  • Woven Glass Reinforced Modified Epoxy IMS
Advanced Rogers PCB materials from Our

Advanced Rogers PCB materials from Our

  • PTFE-based: RO3000 Series, RT Series
  • Non-PTFE: RO4000 Series, Kappa 438
  • Thermoset Ceramic-filled Resin: TMM Series
  • Prepreg Types: RO4400 Series, 2929, RO1200

Select a Rogers Grade by Frequency, Loss Budget and Process

There is no single best Rogers material for every board. Grade selection depends on frequency, loss target, Dk, layer construction, assembly process, thermal environment and test requirements.

Grade Material family Dk Df / condition Typical use Selection signal
RO4003C Hydrocarbon ceramic 3.38 +/- 0.05 0.0027 @ 10 GHz RF, microwave and high-speed builds Balanced loss, Dk and process compatibility
RO4350B Hydrocarbon ceramic 3.48 +/- 0.05 0.0037 @ 10 GHz RF, automotive and qualified lead-free builds Thermal / assembly requirements and controlled impedance
RO3003 Ceramic-filled PTFE 3.00 +/- 0.04 0.0013 @ 10 GHz Very low-loss RF, radar and antenna designs Lower loss at microwave frequencies
RO3006 / RO3010 High-Dk PTFE ceramic 6.15 / 10.2 class Confirm exact grade and method Compact RF and microwave structures Higher Dk for size reduction
RT/duroid 5880 Glass microfiber PTFE 2.20 0.0009 @ 10 GHz Low-loss microwave and mmWave paths Minimum loss and low-Dk construction

Rogers vs FR-4: Where the Performance Difference Matters

FR-4 is a practical baseline for many general-purpose digital and lower-frequency designs. Rogers laminates are selected when loss, Dk stability, impedance or thermal behavior becomes a key design constraint.

Property Rogers PCB FR4
Dielectric Constant (Dk) 2.2 to 10.2 4.3 to 4.8
Dissipation Factor (Df) 0.0009 to 0.003 (@10 GHz) 0.020 to 0.027 (@1 MHz)
Moisture Absorption <0.1% 0.10% to 0.25%
Z-Axis CTE 10 to 17 ppm/°C 40 to 70 ppm/°C
Thermal Conductivity 0.5 to 2.0 W/m·K ~0.25 W/m·K
Glass Transition Temperature (Tg) ≥280°C 130°C to 180°C
Frequency Range Up to 77 GHz Typically <4 GHz
Signal Integrity / Insertion Loss High stability, low loss Weaker above 2 GHz
Processing Complexity Standard for RO4000; specialized for PTFE grades Fully standard processing
Cost Higher Lower
Application Use Case RF, radar, satellite, 5G, phased arrays General-purpose digital and analog electronics
application-automotive-radar

Our Rogers PCB Capabilities

Material Support for Rogers PCB Builds

Data Sheet Showing the Different Roger PCB Models (Table 1)

Property RO4350B RO3003 RO3006 RO3010 RO4835 RO5880 RO6002 RO6010 RO4003 RO 4360G2
Dk, Process (2)3.48 ± 0.05 3.00 ± 0.04 6.15 ± 0.15 10.2 ± 0.30 3.48 ± 0.05 2.20 ± 0.02 2.94 ± 0.04 10.2 ± 0.25 3.38 ± 0.05 6.15 ± 0.15
Dk Design 3.66 3.00 6.50 11.20 3.66 2.20 2.94 – 3.55 –
Dissipation Factor 0.0037 0.0031 0.001 0 0.002 0 0.002 2 0.003 7 0.0004 0.0009 0.001 2 0.002 3 0.0027 0.0021 0.003 8
Thermal Coefficient +50 -3 -262 -395 +50 -125 +12 -425 +40 –
Dimension Stability – -0.06 0.07 -0.27 -0.15 -0.35 -0.31 – – – – – –
Volume Resistivity 1.2 X 10^10 10^7 10^5 10^5 5 x 10^8 2 x 10^7 10^6 5 x 10^5 1.7 X 10^10 4.0 x 10^13
Surface Resistivity 5.7 X 10^9 10^7 10^5 10^5 7 x 10^8 3 x 10^7 10^7 5 x 10^6 4.2 X 10^9 9.0 x 10^12
Electrical Strength 31.2 (780) – – – 30.2 (755) 0.96 (0.23) – – 31.2 (780) 784
Tensile Modulus 16,767 (2,432) 14,153, (2,053) 930 823 1498 1293 1902 1934 7780 (1128) 1070 (156) 450 (65), 860 (125) 380 (55) 828 (120) 931 (135) 19,650 (2,850) 19,450 (2,821) –

Table 2 (Continuation)

Property RO4350B RO3003 RO3006 RO3010 RO4835 RO5880 RO6002 RO6010 RO4003 RO 4360G2
Tensile Strength 203 (29.5) 130 (18.9) – – – 136 (19.7) – – 17 (2.4) 139 (20.2) 100 (14.5) 131 (19) 97 (14)
Flexural Strength 255 (37) – – – 186 (27) – – 4364 (633) 276 (40) 213 (31) 145 (21)
Dimensional Stability <0.5 – – – <0.5 – – – <0.3 –
Coefficient of Thermal Expansion 10 12 32 17 16 25 17 17 24 13 11 16 10 12 32 31 48 237 16 16 24 24 24 24 11 14 46 13 14 28
Tg >280 – – – >280 – – – >280 >280
Td 390 500 500 500 390 500 500 500 425 407
Specific Heat – 0.9 0.86 0.8 – – 0.93 (0.22) 1.00 (0.239) – –
Thermal Conductivity 0.69 0.50 0.79 0.95 0.66 0.22 0.60 0.78 0.71 0.75
Moisture Absorption 0.06 0.04 0.02 0.05 0.05 0.02 0.02 0.05 0.06 0.08
Density 1.86 2.1 2.6 2.8 1.92 2.2 2.1 3.1 1.79 2.16
Copper Peel Strength 0.88 (5.0) 12.7 7.1 9.4 0.88 (5.0) 31.2 (5.5) 8.9 (1.6) 12.3 (2.1) 1.05 (6.0) 5.2 (0.91)
Flammability (3)V-0 V-0 V-0 V-0 V-0 V-0 V-0 94V-0 N/A V-0
Lead-Free Process Compatible Yes Yes Yes Yes Yes Yes Yes Yes Yes –

How to Order Your Rogers PCB

Online Quote
Get an instant quote by providing your details and specifications.
Instant
1
2
Order Review
Our team carefully reviews your order to ensure accuracy.
Quality Check
Payment
Secure your order with a hassle-free payment process.
Secure
3
4
Production
We begin crafting your order with precision and efficiency.
In Progress
Delivery
Your order is shipped swiftly using reliable carriers.
Fast Shipping
5
6
Confirm Received
Receive your order and confirm everything meets your expectations.
Complete

Rogers PCB FAQs

High moisture absorption can shift dielectric constant and increase loss tangent, degrading RF performance. Rogers laminates such as RO4350B and RT/duroid 5880 maintain <0.05% absorption, preserving electrical properties and dimensional stability in high-humidity environments.

RO4350B and RO3003 are commonly used for multilayer RF PCBs due to their low z-axis CTE, stable Dk, and excellent adhesion. These materials support high-density interconnects, via-in-pad routing, and controlled impedance in stackups up to 64 layers with minimal layer shift or thermal distortion.

FR-4 is a general-purpose glass/epoxy family. Rogers includes low-loss hydrocarbon ceramic, ceramic-filled PTFE and other high-frequency laminate families. The correct choice depends on frequency, loss budget, impedance stability, thermal requirements and construction.

Both are RO4000 hydrocarbon ceramic materials. Compare their Dk/Df at the same test condition, then review assembly process, thermal requirements, layer construction, availability and the required qualification documents.

Not always. A hybrid stack-up may use Rogers on RF or antenna layers and FR-4 on digital or power layers when the electrical and thermal construction supports it.