General Drying Process for SMT Chips

The General Process Requirements for SMT Chips Drying Include the Following:

(1) Vacuum-packed chips do not need to be dried.

(2) If we find the humidity indicator card in the vacuum-packed chip is greater than 20% RH when it is unpacked, it must be baked.

(3) If the vacuum package is unpacked and exposed to air for more than 72 hours before production, it must be dried.

(4) If the inventory is not online or the developer uses non-vacuum-packed ICs, if there is no drying mark, it must be dried.

(5) Shenzhen Pcbandassembly: The temperature and humidity controller of the drying box should be set to 10%, the drying time should be more than 48 hours, and the actual humidity should be less than 20%, which is normal.