Design Parameters
The following parameters are exemplary for 35μm copper thickness.
For other thicknesses / special production, please contact our.
| Index | Standard (min.) | Special production(min.) | ||
| A, B, C | Via, buried via
Component hole: |
aspect ratio diameter via pad annular ring |
1:10 200µm 400µm 100µm circular |
1:12 150µm 300µm 75µm circular |
| D | Blind Via, mechanical max. Ø 300µm |
aspect ratio diameter via pad annular ring |
1:1 200µm 400µm 100µm circular |
1:1.2 150µm 350µm 100µm circular |
| E | Blind Via, laser | aspect ratio diameter via pad annular ring |
– – – – |
1:1 100µm 280µm 90µm circular* |
| F | Stacked Vias Disproportional high effort. Please contact our CAM department for alternatives. |
aspect ratio diameter via pad annular ring |
– – – – |
– – – – |
| G | Staggered Vias | aspect ratio diameter via pad annular ring |
1:1 – 1:12 ** 200µm 400µm 100µm circular |
1:1 – 1:12 ** 100µm 300µm 90µm circular |
| H, I | Conductors |
width | space | 100µm | 100µm | 75µm | 75µm |
| J | Conductor/pad to milling edge Conductor/pad to scoring edge |
space | 200µm 500µm |
200µm 500µm |
| K | Conductor/pad to hole (PTH, NPTH) | space | 200µm | 200µm |
| L | Solder-stop, green | clearance bridge |
50µm circular 100µm |
25µm circ. (BGA) 80µm |
| Solder-stop, other colors | clearance bridge |
– – |
50µm circular 125µm |
* Prior data check necessary. ** see Buried Via, Blind Via