Custom PCB Manufacturing from Prototype to Production
OrinewPCB provides custom printed circuit board fabrication for engineering prototypes, product launches, and repeat production. Our engineering team reviews your manufacturing data, material requirements, layer stackup, and testing needs before production begins.
14+
Years Experience
98.15%
On-Time Delivery
96%
customer satisfaction rate
99%
Quality Pass Rate
PCB Fabrication for Prototypes and Production
Our PCB fabrication service is designed to support the full transition from a first prototype to repeat production. Before releasing a job, we review the board construction, material availability, drill and routing requirements, copper distribution, surface finish, and test method.
For standard boards, the process is optimized for predictable cost and lead time. For HDI, high-frequency, heavy-copper, thermal, flex, and rigid-flex designs, our engineers confirm the construction and manufacturing rules before quoting.
Standard PCB Fabrication
FR-4 rigid boards for prototypes, control systems, consumer products, and general electronics.
Quote Standard PCB
Advanced PCB Manufacturing
HDI, controlled-impedance, high-frequency, high-Tg, and heavy-copper builds for higher routing density, thermal load, or reliability requirements.
Review Advanced Build
Specialty PCB Solutions
Aluminum, flex, rigid-flex, RF, and application-specific boards reviewed by material, stackup, geometry, testing, and volume.
Discuss Specialty PCBMaterials and Board Types
FR-4
Cost-effective and versatile
High-Tg FR-4
Improved thermal performance
Halogen-Free
Environmentally friendly options
High-Frequency / RF
Low loss, stable performance
Aluminum / Metal-Core
Excellent thermal management
Heavy Copper
Enhanced current carrying capacity
Flex / Rigid-Flex
Space-saving, dynamic applications
PCB Manufacturing Capability
Layer Support & Board Stackup
We support PCB stackups from 1 to 64 layers, including complex high-density interconnect (HDI) architectures such as 1+n+1 through 8+n+8 and 18L any-layer interconnect structures.
Our via technologies include blind, buried, via-in-pad, stacked microvias, and via-in-via designs, supporting an aspect ratio of up to 40:1 for robust multilayer PCB performance in high-reliability environments.
| Feature | Specification |
| Supported Layer Count | 1 to 64 layers |
| HDI Stack-Up Architectures | Configurations such as 1+n+1, 2+n+2, up to 8+n+8; 18L any-layer interconnect supported. |
| Via Technologies | Blind vias, buried vias, stacked microvias (laser-formed, 4 to 6 mil), via-in-pad (VIP), via-in-via, skip vias. Supports staggered or stacked via structures with copper-filled and resin-filled options. Laser via diameter: 3 to 6 mil (0.075 to 0.15 mm); mechanical via minimum: 0.1 mm. |
| Maximum Aspect Ratio | Up to 40:1 for high-reliability multilayer builds. |
| Minimum Drill Size | Mechanical: 0.1 mm; Laser: 3 to 6 mil (0.076 to 0.15 mm). |
| Finished Board Thickness | 0.1 to 12 mm. |
| Via Copper Plating Thickness | ≥25 µm (1 mil); uniformity within ±10%. |
| Dielectric Thickness Control | Prepreg layers down to 0.075 mm ±10% precision. |
| Stack-Up Symmetry Options | Symmetrical and bookbinder (asymmetrical) stack-ups are supported. |
| Impedance Control Support | Supported on specified layers; single-ended and differential; tolerance ±5% |
Line Width / Spacing & Mechanical Limits
Our fabrication capabilities achieve trace widths and spacings down to 1.8 mil (0.045 mm), ideal for fine-pitch components and HDI layouts. We support PTH diameters down to 0.08 mm, minimum routed slot widths of 0.5 mm, and silkscreen minimum line widths of 4 mil.
Solder mask dam resolution is 3 mil, with routing tolerance maintained within ±0.04 mm for precise board outlines and mechanical features.
Copper & Board Thickness
We manufacture PCBs with finished copper weights ranging from 0.5 oz to 28 oz (≈1000 μm), supporting both signal integrity and high current applications.
Final board thickness options span from 0.1 mm to 12 mm, enabling fabrication of ultra-thin flex boards to thick, heavy-copper PCBs for power electronics.
Substrate Materials
OrinewPCB offers a broad spectrum of PCB base materials, including standard FR4, high-Tg FR4, halogen-free, and CEM-3 for general applications.
For specialized performance, we fabricate with Rogers RO4003 and RO4350 for RF circuits, ceramic substrates for thermal stability, polyimide for flexible PCBs, and metal-core materials such as aluminum and copper for LED and power conversion boards.
Surface Finishes
We support all mainstream and advanced surface finishes, including HASL (leaded and lead-free), ENIG (Electroless Nickel Immersion Gold), ENEPIG, OSP (Organic Solderability Preservative), immersion silver, and immersion tin.
Selective finish combinations such as ENIG+OSP are available for mixed component assemblies, gold fingers, and edge connectors.
Soldermask & Legend
Solder mask is available in green, black, blue, white, yellow, and matte variants with hardness up to 6H and flammability rating UL94V-0.
Our high-resolution legend printing uses white, yellow, or black inks with a minimum line width of 4 mil for clear component markings and assembly labels.
Testing & Reliability
All boards undergo 100% electrical testing via flying probe or bed-of-nails methods. Additional reliability testing includes impedance control with ±3 Ω tolerance, thermal shock testing, and warp/twist validation ≤0.5%.
We provide IPC-Class 2 or Class 3 inspection and reporting upon request for applications requiring elevated reliability standards.
Certifications & Compliance
OrinewPCB is certified to ISO 9001:2015 (Quality), ISO 14001:2015 (Environmental), and IATF 16949:2016 for automotive-grade PCBs.
We also hold ISO 13485:2016 certification for medical device compliance. All PCBs are UL-listed, RoHS and REACH compliant, and manufactured to IPC-A-600 and IPC-6012 quality standards.
Printed Circuit Board Manufacturing Services
PCB Prototype
Quick Turn + Low Cost
- 1-12 Layers PCB
- Quantity: 5-1000PCS
- Standard: IPC-II IPC-III
- Lead time: 2-9 Days
- Materials: Fr4
Advanced PCB Fab
Complex PCB + R&D Support
- 8 – 56 Layer PCB
- Quantity: 1 - 1Million
- Standard: IPC III, Military Grade, Medical Grade
- Lead Time: 12-30 Days
- Types: HDI, Rigid-flex, Extremely Cooper...
Engineering
DFM & DFA Verification
OrinewPCB provides complimentary Design for Manufacturing (DFM) and Design for Assembly (DFA) verification with every order. Our expert review ensures your design is fully optimized for our production capabilities throughout the entire fabrication and assembly process.
Quote NowRF & Microwave
Low frequency + High frequency
- 1-24 Layers PCB
- Quantity: 1-5000PCS
- Standard: IPC-II IPC-III
- Tech: Hybrid with Fr4, Alu...
- Materials:Rogers, Arlon, Taconic, Isola, Nelco
Flex & Rigid Board
DFM & DFA Verification
- Flex part: 1-8 Layers
- Rigid part: 4-32 Layers
- Stiffener: FR4, PI, Alu, Steel
- Surface:Enig, Hard Gold...
- Application: Robots, Wearable, Connectors..
HDI Board
Blind Vias + Buried Vias
- 4-56 Layer
- Laser-drilled microvias 2.5mil
- BGA pitch down to 0.20 mm
- Controlled impedance builds
- Types: Blind vias, Buried, Anylayer HDI
Manufacturing Process
From uploaded manufacturing files to finished boards, each build is prepared, reviewed, fabricated, inspected, and packed against approved requirements.
Engineering Review
We review your files for manufacturability and requirements.
CAM & DFM Preparation
DFM analysis and CAM data are prepared for production.
Material & Stackup Confirmation
Materials and board stackup are confirmed before fabrication.
PCB Fabrication
Boards are fabricated using controlled manufacturing processes.
Inspection & Electrical Testing
Boards undergo process checks and electrical testing as applicable.
Final Review & Shipment
Final verification, packaging, and secure shipment.
Quality Control and Testing
Quality is controlled from supplier approval and incoming material inspection through CAM review, process inspection, electrical testing, and final shipment verification. The inspection plan is matched to the board construction and the customer’s quality requirements.
| Stage | What is checked | Possible record / output |
| Supplier and material control | Laminate identity, copper, certificates, shelf life | Material certificate / incoming record |
| CAM and contract review | Data completeness, stackup, tolerances, delivery requirements | Reviewed manufacturing data |
| In-process inspection | Registration, drilling, plating, etching, solder mask, dimensions | Process inspection record |
| Optical inspection | Visible circuit, solder mask, legend, surface defects | AOI or visual inspection record |
| Electrical testing | Opens, shorts, isolation and continuity as specified | E-test / flying probe record |
| Impedance verification | Controlled impedance structures where required | Impedance report / TDR data |
| Final inspection | Dimensions, finish, quantity, packaging and documentation | Final inspection record |
