ISO 9001:2008 Certified

PCB Manufacturing Services

Custom Circuit Board Fabrication

PCBAndAssembly, based in China, is a global embedded PCB manufacturer offering end-to-end PCB fabrication services with advanced DFM support and strict IPC-A-610 Class 3 quality standards. We provide quick-turn PCB prototyping and production for clients in the USA and across the world.

  • 72-hour lead time for standard 1 to 12-layer PCB prototypes
  • PCB fabrication with copper weights up to 28 oz, HDI support, and up to 64-layer stackups
  • ISO 9001, RoHS, and UL-certified PCB manufacturer
  • Full turnkey PCB assembly services
Factory - PCBAndAssembly

14+

Years Experience

98.15%

On-Time Delivery

96%

customer satisfaction rate

99%

Quality Pass Rate

PCB Manufacturing Capability

Layer Support & Board Stackup

We support PCB stackups from 1 to 64 layers, including complex high-density interconnect (HDI) architectures such as 1+n+1 through 8+n+8 and 18L any-layer interconnect structures.

Our via technologies include blind, buried, via-in-pad, stacked microvias, and via-in-via designs, supporting an aspect ratio of up to 40:1 for robust multilayer PCB performance in high-reliability environments.

Feature Specification
Supported Layer Count 1 to 64 layers
HDI Stack-Up Architectures Configurations such as 1+n+1, 2+n+2, up to 8+n+8; 18L any-layer interconnect supported.
Via Technologies Blind vias, buried vias, stacked microvias (laser-formed, 4 to 6 mil), via-in-pad (VIP), via-in-via, skip vias. Supports staggered or stacked via structures with copper-filled and resin-filled options. Laser via diameter: 3 to 6 mil (0.075 to 0.15 mm); mechanical via minimum: 0.1 mm.
Maximum Aspect Ratio Up to 40:1 for high-reliability multilayer builds.
Minimum Drill Size Mechanical: 0.1 mm; Laser: 3 to 6 mil (0.076 to 0.15 mm).
Finished Board Thickness 0.1 to 12 mm.
Via Copper Plating Thickness ≥25 µm (1 mil); uniformity within ±10%.
Dielectric Thickness Control Prepreg layers down to 0.075 mm ±10% precision.
Stack-Up Symmetry Options Symmetrical and bookbinder (asymmetrical) stack-ups are supported.
Impedance Control Support Supported on specified layers; single-ended and differential; tolerance ±5%

Line Width / Spacing & Mechanical Limits

Our fabrication capabilities achieve trace widths and spacings down to 1.8 mil (0.045 mm), ideal for fine-pitch components and HDI layouts. We support PTH diameters down to 0.08 mm, minimum routed slot widths of 0.5 mm, and silkscreen minimum line widths of 4 mil.

Solder mask dam resolution is 3 mil, with routing tolerance maintained within ±0.04 mm for precise board outlines and mechanical features.

Copper & Board Thickness

We manufacture PCBs with finished copper weights ranging from 0.5 oz to 28 oz (≈1000 μm), supporting both signal integrity and high current applications.

Final board thickness options span from 0.1 mm to 12 mm, enabling fabrication of ultra-thin flex boards to thick, heavy-copper PCBs for power electronics.

Substrate Materials

PCBAndAssembly offers a broad spectrum of PCB base materials, including standard FR4, high-Tg FR4, halogen-free, and CEM-3 for general applications.

For specialized performance, we fabricate with Rogers RO4003 and RO4350 for RF circuits, ceramic substrates for thermal stability, polyimide for flexible PCBs, and metal-core materials such as aluminum and copper for LED and power conversion boards.

Surface Finishes

We support all mainstream and advanced surface finishes, including HASL (leaded and lead-free), ENIG (Electroless Nickel Immersion Gold), ENEPIG, OSP (Organic Solderability Preservative), immersion silver, and immersion tin.

Selective finish combinations such as ENIG+OSP are available for mixed component assemblies, gold fingers, and edge connectors.

Soldermask & Legend

Solder mask is available in green, black, blue, white, yellow, and matte variants with hardness up to 6H and flammability rating UL94V-0.

Our high-resolution legend printing uses white, yellow, or black inks with a minimum line width of 4 mil for clear component markings and assembly labels.

Testing & Reliability

All boards undergo 100% electrical testing via flying probe or bed-of-nails methods. Additional reliability testing includes impedance control with ±3 Ω tolerance, thermal shock testing, and warp/twist validation ≤0.5%.

We provide IPC-Class 2 or Class 3 inspection and reporting upon request for applications requiring elevated reliability standards.

Certifications & Compliance

PCBAndAssembly is certified to ISO 9001:2015 (Quality), ISO 14001:2015 (Environmental), and IATF 16949:2016 for automotive-grade PCBs.

We also hold ISO 13485:2016 certification for medical device compliance. All PCBs are UL-listed, RoHS and REACH compliant, and manufactured to IPC-A-600 and IPC-6012 quality standards.

How To Order From PCBAndAssembly

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PCB Manufacture FAQS

We support minimum trace/space dimensions of 1.8 mil (0.045 mm), suitable for fine-pitch HDI and RF applications.

Yes, we provide custom stackup diagrams with dielectric spacing and material data targeting ±3 Ω impedance control, verified through simulation and impedance testing.

Yes, we support IPC Class 2 and Class 3 production standards, including inspection protocols and documentation for high-reliability applications.

We offer finished copper thicknesses up to 1000 μm (approximately 28 oz), supporting high-current and power distribution needs.