PCB Manufacturing Services
Custom Circuit Board Fabrication
PCBAndAssembly, based in China, is a global embedded PCB manufacturer offering end-to-end PCB fabrication services with advanced DFM support and strict IPC-A-610 Class 3 quality standards. We provide quick-turn PCB prototyping and production for clients in the USA and across the world.
14+
Years Experience
98.15%
On-Time Delivery
96%
customer satisfaction rate
99%
Quality Pass Rate
PCB Manufacturing Capability
Layer Support & Board Stackup
We support PCB stackups from 1 to 64 layers, including complex high-density interconnect (HDI) architectures such as 1+n+1 through 8+n+8 and 18L any-layer interconnect structures.
Our via technologies include blind, buried, via-in-pad, stacked microvias, and via-in-via designs, supporting an aspect ratio of up to 40:1 for robust multilayer PCB performance in high-reliability environments.
| Feature | Specification |
| Supported Layer Count | 1 to 64 layers |
| HDI Stack-Up Architectures | Configurations such as 1+n+1, 2+n+2, up to 8+n+8; 18L any-layer interconnect supported. |
| Via Technologies | Blind vias, buried vias, stacked microvias (laser-formed, 4 to 6 mil), via-in-pad (VIP), via-in-via, skip vias. Supports staggered or stacked via structures with copper-filled and resin-filled options. Laser via diameter: 3 to 6 mil (0.075 to 0.15 mm); mechanical via minimum: 0.1 mm. |
| Maximum Aspect Ratio | Up to 40:1 for high-reliability multilayer builds. |
| Minimum Drill Size | Mechanical: 0.1 mm; Laser: 3 to 6 mil (0.076 to 0.15 mm). |
| Finished Board Thickness | 0.1 to 12 mm. |
| Via Copper Plating Thickness | ≥25 µm (1 mil); uniformity within ±10%. |
| Dielectric Thickness Control | Prepreg layers down to 0.075 mm ±10% precision. |
| Stack-Up Symmetry Options | Symmetrical and bookbinder (asymmetrical) stack-ups are supported. |
| Impedance Control Support | Supported on specified layers; single-ended and differential; tolerance ±5% |
Line Width / Spacing & Mechanical Limits
Our fabrication capabilities achieve trace widths and spacings down to 1.8 mil (0.045 mm), ideal for fine-pitch components and HDI layouts. We support PTH diameters down to 0.08 mm, minimum routed slot widths of 0.5 mm, and silkscreen minimum line widths of 4 mil.
Solder mask dam resolution is 3 mil, with routing tolerance maintained within ±0.04 mm for precise board outlines and mechanical features.
Copper & Board Thickness
We manufacture PCBs with finished copper weights ranging from 0.5 oz to 28 oz (≈1000 μm), supporting both signal integrity and high current applications.
Final board thickness options span from 0.1 mm to 12 mm, enabling fabrication of ultra-thin flex boards to thick, heavy-copper PCBs for power electronics.
Substrate Materials
PCBAndAssembly offers a broad spectrum of PCB base materials, including standard FR4, high-Tg FR4, halogen-free, and CEM-3 for general applications.
For specialized performance, we fabricate with Rogers RO4003 and RO4350 for RF circuits, ceramic substrates for thermal stability, polyimide for flexible PCBs, and metal-core materials such as aluminum and copper for LED and power conversion boards.
Surface Finishes
We support all mainstream and advanced surface finishes, including HASL (leaded and lead-free), ENIG (Electroless Nickel Immersion Gold), ENEPIG, OSP (Organic Solderability Preservative), immersion silver, and immersion tin.
Selective finish combinations such as ENIG+OSP are available for mixed component assemblies, gold fingers, and edge connectors.
Soldermask & Legend
Solder mask is available in green, black, blue, white, yellow, and matte variants with hardness up to 6H and flammability rating UL94V-0.
Our high-resolution legend printing uses white, yellow, or black inks with a minimum line width of 4 mil for clear component markings and assembly labels.
Testing & Reliability
All boards undergo 100% electrical testing via flying probe or bed-of-nails methods. Additional reliability testing includes impedance control with ±3 Ω tolerance, thermal shock testing, and warp/twist validation ≤0.5%.
We provide IPC-Class 2 or Class 3 inspection and reporting upon request for applications requiring elevated reliability standards.
Certifications & Compliance
PCBAndAssembly is certified to ISO 9001:2015 (Quality), ISO 14001:2015 (Environmental), and IATF 16949:2016 for automotive-grade PCBs.
We also hold ISO 13485:2016 certification for medical device compliance. All PCBs are UL-listed, RoHS and REACH compliant, and manufactured to IPC-A-600 and IPC-6012 quality standards.
Printed Circuit Board Manufacturing Services
PCB Prototype
Quick Turn + Low Cost
- 1-12 Layers PCB
- Quantity: 5-1000PCS
- Standard: IPC-II IPC-III
- Lead time: 2-9 Days
- Materials: Fr4
Advanced PCB Fab
Complex PCB + R&D Support
- 8 – 56 Layer PCB
- Quantity: 1 - 1Million
- Standard: IPC III, Military Grade, Medical Grade
- Lead Time: 12-30 Days
- Types: HDI, Rigid-flex, Extremely Cooper...
Engineering
DFM & DFA Verification
PCBAndAssembly provides complimentary Design for Manufacturing (DFM) and Design for Assembly (DFA) verification with every order. Our expert review ensures your design is fully optimized for our production capabilities throughout the entire fabrication and assembly process.
Quote NowRF & Microwave
Low frequency + High frequency
- 1-24 Layers PCB
- Quantity: 1-5000PCS
- Standard: IPC-II IPC-III
- Tech: Hybrid with Fr4, Alu...
- Materials:Rogers, Arlon, Taconic, Isola, Nelco
Flex & Rigid Board
DFM & DFA Verification
- Flex part: 1-8 Layers
- Rigid part: 4-32 Layers
- Stiffener: FR4, PI, Alu, Steel
- Surface:Enig, Hard Gold...
- Application: Robots, Wearable, Connectors..
HDI Board
Blind Vias + Buried Vias
- 4-56 Layer
- Laser-drilled microvias 2.5mil
- BGA pitch down to 0.20 mm
- Controlled impedance builds
- Types: Blind vias, Buried, Anylayer HDI
Quality Management
PCBAndAssembly is an ISO9001 certified PCB manufacturer committed to meeting customer requirements throughout every production stage—from supplier selection to final delivery.
Supplier Management
All suppliers undergo rigorous evaluation and approval before partnership. Annual performance reviews ensure consistent material quality, with continuous improvement programs aligned to ISO9001 standards.
Contract & Design Review
Every order is thoroughly reviewed to verify PCBsync’s capability to meet specifications, delivery schedules, and customer requirements before acceptance.
Manufacturing Documentation
Customer design files are converted into controlled manufacturing instructions (MI) through CAM processing. All MIs undergo multi-level engineering review and QA approval, with first article inspection confirming drilling and routing data accuracy.
Incoming Quality Control (IQC)
All materials are inspected and verified before warehousing using precision equipment and strict procedures. A computerized FIFO system manages inventory and alerts staff before material expiration dates.
Process Controls
Production is controlled through validated manufacturing instructions, preventive equipment maintenance, comprehensive WIP inspection, and AOI systems. These measures ensure semi-finished and finished products meet customer specifications.
Final Inspection & Testing
All PCBs undergo electrical testing (open/short), visual inspection, and physical verification. Advanced equipment includes AOI Testing, 3D AOI, 3D SPI, X-ray inspection, and In-Circuit Testing for assemblies.
Outgoing Quality Audit (FQA)
Final products are sample-inspected against customer specifications before packing. Every shipment receives 100% verification of part numbers, quantities, destinations, and packing documentation prior to delivery.