Rogers PCB Manufacturing
Rogers PCB Manufacturing for High-Frequency Signal Integrity
Rogers PCBs are printed circuit boards made from engineered Rogers circuit board material, specifically designed to minimize dielectric loss, support high-frequency operation, and provide stable electrical performance across a wide frequency range. WellPCB fabricates Rogers printed circuit boards to deliver superior performance for your most demanding applications.
- Rogers PCB fabrication with low-loss, low-moisture absorption substrates.
- Rogers material support for RF, radio frequency, and high-speed digital circuits.
- Tight DK and DF control with IPC-compliant performance and streamlined properties over traditional PCB materials.
Types of Rogers PCB Materials
Metal Claddings
- Rolled
- Electrodeposited
- Electrodeposited Reverse Treated
- Resistive Foil
Bonding Materials
- Ceramic PTFE Bondply
- Woven Glass
- Prepreg
- Hydrocarbon
- Thermoset Thermal and Electrically Conductive Adhesive (TECA) Film
Laminates
- Woven Glass Reinforced Modified Epoxy Laminates
- PTFE Random Glass Fiber
- Woven Glass UL 94 V-0 laminates
- Hydrocarbon
- PTFE Ceramic
- Cross-Plied Woven Glass-Reinforced PTFE
- Woven Glass Reinforced PTFE Antenna Grade Laminates
- Filled PTFE Composite
- Woven Glass Reinforced Modified Epoxy IMS
Advanced Rogers PCB materials from Our
- PTFE-based: RO3000 Series, RT Series
- Non-PTFE: RO4000 Series, Kappa 438
- Thermoset Ceramic-filled Resin: TMM Series
- Prepreg Types: RO4400 Series, 2929, RO1200
Our Rogers PCB Capabilities
Material Support for Rogers PCB Builds
Data Sheet Showing the Different Roger PCB Models (Table 1)
| Property | RO4350B | RO3003 | RO3006 | RO3010 | RO4835 | RO5880 | RO6002 | RO6010 | RO4003 | RO 4360G2 |
| Dk, Process | (2)3.48 ± 0.05 | 3.00 ± 0.04 | 6.15 ± 0.15 | 10.2 ± 0.30 | 3.48 ± 0.05 | 2.20 ± 0.02 | 2.94 ± 0.04 | 10.2 ± 0.25 | 3.38 ± 0.05 | 6.15 ± 0.15 |
| Dk Design | 3.66 | 3.00 | 6.50 | 11.20 | 3.66 | 2.20 | 2.94 | – | 3.55 | – |
|---|---|---|---|---|---|---|---|---|---|---|
| Dissipation Factor | 0.0037 0.0031 | 0.001 0 | 0.002 0 | 0.002 2 | 0.003 7 | 0.0004 0.0009 | 0.001 2 | 0.002 3 | 0.0027 0.0021 | 0.003 8 |
| Thermal Coefficient | +50 | -3 | -262 | -395 | +50 | -125 | +12 | -425 | +40 | – |
| Dimension Stability | – | -0.06 0.07 | -0.27 -0.15 | -0.35 -0.31 | – | – | – | – | – | – |
| Volume Resistivity | 1.2 X 10^10 | 10^7 | 10^5 | 10^5 | 5 x 10^8 | 2 x 10^7 | 10^6 | 5 x 10^5 | 1.7 X 10^10 | 4.0 x 10^13 |
| Surface Resistivity | 5.7 X 10^9 | 10^7 | 10^5 | 10^5 | 7 x 10^8 | 3 x 10^7 | 10^7 | 5 x 10^6 | 4.2 X 10^9 | 9.0 x 10^12 |
| Electrical Strength | 31.2 (780) | – | – | – | 30.2 (755) | 0.96 (0.23) | – | – | 31.2 (780) | 784 |
| Tensile Modulus | 16,767 (2,432) 14,153, (2,053) | 930 823 | 1498 1293 | 1902 1934 | 7780 (1128) | 1070 (156) 450 (65), 860 (125) 380 (55) | 828 (120) | 931 (135) | 19,650 (2,850) 19,450 (2,821) | – |
Table 2 (Continuation)
| Property | RO4350B | RO3003 | RO3006 | RO3010 | RO4835 | RO5880 | RO6002 | RO6010 | RO4003 | RO 4360G2 |
| Tensile Strength | 203 (29.5) 130 (18.9) | – | – | – | 136 (19.7) | – | – | 17 (2.4) | 139 (20.2) 100 (14.5) | 131 (19) 97 (14) |
|---|---|---|---|---|---|---|---|---|---|---|
| Flexural Strength | 255 (37) | – | – | – | 186 (27) | – | – | 4364 (633) | 276 (40) | 213 (31) 145 (21) |
| Dimensional Stability | <0.5 | – | – | – | <0.5 | – | – | – | <0.3 | – |
| Coefficient of Thermal Expansion | 10 12 32 | 17 16 25 | 17 17 24 | 13 11 16 | 10 12 32 | 31 48 237 | 16 16 24 | 24 24 24 | 11 14 46 | 13 14 28 |
| Tg | >280 | – | – | – | >280 | – | – | – | >280 | >280 |
| Td | 390 | 500 | 500 | 500 | 390 | 500 | 500 | 500 | 425 | 407 |
| Specific Heat | – | 0.9 | 0.86 | 0.8 | – | – | 0.93 (0.22) | 1.00 (0.239) | – | – |
| Thermal Conductivity | 0.69 | 0.50 | 0.79 | 0.95 | 0.66 | 0.22 | 0.60 | 0.78 | 0.71 | 0.75 |
| Moisture Absorption | 0.06 | 0.04 | 0.02 | 0.05 | 0.05 | 0.02 | 0.02 | 0.05 | 0.06 | 0.08 |
| Density | 1.86 | 2.1 | 2.6 | 2.8 | 1.92 | 2.2 | 2.1 | 3.1 | 1.79 | 2.16 |
| Copper Peel Strength | 0.88 (5.0) | 12.7 | 7.1 | 9.4 | 0.88 (5.0) | 31.2 (5.5) | 8.9 (1.6) | 12.3 (2.1) | 1.05 (6.0) | 5.2 (0.91) |
| Flammability | (3)V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | 94V-0 | N/A | V-0 |
| Lead-Free Process Compatible | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes | – |
Controlled Impedance and RF Performance
All Rogers PCBs are modeled with ±3 Ω impedance tolerance for microstrip and stripline structures.
Laminate selection and dielectric thickness are optimized to minimize signal loss and maintain signal integrity in multilayer stackups up to 64 layers, supporting high-speed transmission above 6 GHz.
Advanced Via Structures for High-Density Designs
We fabricate boards with microvias, blind vias, and via-in-pad routing using 3 mil laser drilling.
These features are compatible with high-frequency Rogers material PCB builds and are supported by CF4/O2 plasma cleaning for improved plated through-hole reliability on low z-axis coefficient of thermal expansion substrates.
Low-Loss PCB Fabrication
Our Rogers board manufacturing process maintains consistent trace width/spacing down to 1.8 mil and supports copper foil weights from 0.33 oz to 28 oz.
These parameters are essential for reducing dielectric loss in high-frequency PCBs and improving thermal conductivity without compromising dimensional stability.
Hybrid Stackups with FR4 and Rogers Materials
PCBAndAssembly manufactures hybrid PCBs combining FR4 with Rogers circuit board material to reduce fabrication costs while preserving RF layer performance.
These constructions balance substrate dielectric properties and structural efficiency, especially in designs requiring isolated signal layers and controlled impedance routing.
Thermal and Mechanical Stability
All Rogers PCBs are validated for mechanical properties under thermal cycling. RO4000 and TMM series materials exhibit stable z-axis CTE between 10 and 17 ppm/°C, high Tg values ≥280°C, and low moisture absorption, making them ideal for high-temperature or humid environments like radar and telecommunications modules.
Surface Finish and Solder Mask Options
We offer ENIG, Immersion Silver, OSP, and Lead-Free HASL finishes over treated Rogers laminate materials.
Matte and gloss solder masks are applied after pre-baking at 110°C to 125°C for 30 to 60 minutes to preserve trace spacing and achieve clean coverage on high-frequency substrates.
Comprehensive PCB Testing and Inspection
Every Rogers printed circuit board undergoes AOI, X-ray, impedance testing, and netlist-based electrical verification.
Boards built with Rogers material are inspected for consistency in electrical properties, DK/DF performance, and fabrication integrity to meet IPC-4103 and IPC-6012 Class 3 standards.
Why Choose PCBAndAssembly as Your Rogers PCB Manufacturer?
PCB delivers Rogers PCB manufacturing solutions for applications requiring precise dielectric performance, thermal reliability, and RF circuit control. We support builds using hydrocarbon ceramic and PTFE-based laminates, offering controlled Dk values, multilayer signal stability, and trace integrity across demanding frequency environments.
Our facilities are optimized for producing high-speed circuit boards with consistent CTE behavior, low insertion loss, and IPC-A-610H Class 3 verification on every layer.
What Is a Rogers PCB Material?
Rogers PCB material is a high-frequency substrate engineered by Rogers Corporation using ceramic-filled PTFE and hydrocarbon ceramic composites. Unlike FR4, these laminates offer low dielectric loss, stable dielectric constant (2.2 to 10.2), and Df values as low as 0.001, enabling consistent signal transmission in RF, radar, and high-speed digital circuits.
Rogers materials feature low moisture absorption, z-axis CTE between 10 and 17 ppm/°C, and high Tg ≥280°C, making them ideal for multilayer PCB fabrication exposed to thermal cycling. Common series include RO4000 (eg. RO4350B, RO4003C), RO3000, RT/duroid, and TMM, each tailored for specific electrical, mechanical, and processing demands.
Rogers PCB Material Series
RO4000 Series: RO4000 series laminates are hydrocarbon ceramic materials with Dk values from 3.38 to 6.15 and Tg above 280°C.They support low dielectric loss (Df < 0.0037 @10 GHz) and are compatible with standard FR4 processing.RO4350B and RO4003C are widely used for controlled impedance transmission lines, RF filters, and multilayer boards in high-speed digital systems.
RO3000 Series: RO3000 series uses PTFE-ceramic composites with tightly controlled Dk and very low loss tangent.RO3003 (Dk = 3.00 ± 0.04, Df = 0.0013) is optimized for radar and RF power modules. RO3010 (Dk = 10.2 ± 0.30) supports miniaturized circuits requiring high signal density.These materials maintain dimensional stability and signal integrity up to 77 GHz.
RT/duroid Series: RT/duroid 5880 and 5870 are low-Dk, ultra-low-loss laminates (Dk = 2.20, Df = 0.0009) used in military, aerospace, and microwave systems.With chemical resistance, low CTE, and dielectric breakdown voltages up to 9 kV/mm, these materials are built for RF circuit boards exposed to radiation, vibration, and temperature cycling.
TMM Series: TMM series thermoset materials offer high thermal conductivity and excellent mechanical strength.TMM10 and TMM3 support Dk values from 3.27 to 10.2 with low Df, making them ideal for microwave circuits requiring phase stability.These laminates withstand solder reflow and maintain interlayer adhesion across wide thermal gradients.
Rogers PCB vs FR4
| Property | Rogers PCB | FR4 |
| Dielectric Constant (Dk) | 2.2 to 10.2 | 4.3 to 4.8 |
| Dissipation Factor (Df) | 0.0009 to 0.003 (@10 GHz) | 0.020 to 0.027 (@1 MHz) |
| Moisture Absorption | <0.1% | 0.10% to 0.25% |
| Z-Axis CTE | 10 to 17 ppm/°C | 40 to 70 ppm/°C |
| Thermal Conductivity | 0.5 to 2.0 W/m·K | ~0.25 W/m·K |
| Glass Transition Temperature (Tg) | ≥280°C | 130°C to 180°C |
| Frequency Range | Up to 77 GHz | Typically <4 GHz |
| Signal Integrity / Insertion Loss | High stability, low loss | Weaker above 2 GHz |
| Processing Complexity | Standard for RO4000; specialized for PTFE grades | Fully standard processing |
| Cost | Higher | Lower |
| Application Use Case | RF, radar, satellite, 5G, phased arrays | General-purpose digital and analog electronics |
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