PCB BOM: How to Fill Each Field and Check for Errors

By Published On: November 12th, 2026Last Updated: November 12th, 2026

Learn how to fill a PCB BOM, verify MPN suffixes and Imperial/Metric packages, handle DNP parts, and cross-check assembly files before submission.

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PCB BOM editorial cover with a realistic illustrative assembly workstation, component reels and a blank component list.

Table of Contents

A PCB Bill of Materials (BOM) is the master component list that tells your assembler which parts to buy, where to place them, and how many are needed per board. A production-ready BOM ties every component to a complete Manufacturer Part Number (MPN), an unambiguous per-board quantity, an explicit fitted status (Fitted vs. DNP), and the exact PCB revision and assembly variant.

BOM Readiness at a Glance — 5 Rules Before You Send

  • Identify parts by Manufacturer + complete MPN: Never rely on a generic value (10k), truncated code, or distributor link alone.
  • Separate design count from purchase quantity: Per-board quantity belongs in the BOM; attrition, spares, and MOQ belong on the purchase order.
  • Keep DNP, Variant, and Supply in separate columns: Customer-supplied parts are still Fitted, not DNP.
  • Specify Imperial vs. Metric package codes: Imperial 0603 (1.6 × 0.8 mm) is much larger than Metric 0603 (0.6 × 0.3 mm / Imperial 0201) and uses incompatible land patterns.
  • Reopen the exported file after saving: Inspect .csv or .xlsx exports to catch Excel date conversions, stripped leading zeros, and broken portal mappings.

What Is a PCB BOM—and How Does It Work with Other Assembly Files?

Your assembly BOM defines what goes on the board; your fabrication files, placement file, and assembly drawing define where and how it is built. Keeping each document focused prevents conflicting instructions across engineering, purchasing, and the SMT line.

Illustrative PCB surrounded by BOM, fabrication, placement and assembly drawing examples showing four file roles.
Assembly File Primary Question Answered Key Fields to Cross-Check
Assembly BOM Which parts go on this build, at which designators, and in what quantity? Manufacturer, complete MPN, description, package, Fitted/DNP status, supply owner
Bare-Board Fabrication Data What board geometry, layer stackup, and drill specs must be manufactured? Board ID, PCB revision, Gerber / ODB++ / IPC-2581 layers, drill files, fab notes
Placement File (P&P / Centroid / CPL) Where is each SMD part placed (X/Y), on which side, and at what rotation? Reference designators, units (mm/mil), board origin, top/bottom layer, rotation
Assembly Drawing What visual cues and special rules govern orientation and hand-soldering? Pin-1 dots, diode/cap polarity, DNP outlines, mechanical hardware, coating notes

Format note on Gerber X3 and IPC-2581: Traditional Gerber RS-274X carries 2D board layer images (such as copper, solder mask, and silkscreen) without structured BOM data, whereas Gerber X3 and IPC-2581 can embed component and BOM data in the CAD export. Even when exporting those formats, confirm whether your contract manufacturer still requires a standalone .xlsx or .csv BOM for quoting and ERP import.

Why placement row counts rarely match BOM row counts: Depending on exporter settings and assembler preferences, placement exporters (such as KiCad 9.0 PCB Editor) often filter out DNP parts and through-hole (THT) components while adding fiducials. A grouped BOM row like R1, R2 (1 row) also expands into 2 rows in the placement file. Always compare expanded reference designator sets within the same mounting scope rather than raw row counts.

How to Fill Each PCB BOM Field

We recommend a 5-item header block plus 10 core columns (and 1 optional purchasing column) so purchasing and production can verify each row without guessing.

Chip resistor and R1/R2 board positions linked to example BOM identity, designator, package and fitted-status fields.

Header Metadata (Place at the Top of the Sheet or Cover Tab)

Include these five identifiers on every release so your BOM cannot be paired with the wrong bare board:

1. Assembly ID: DEMO-BOM-01
2. PCB Rev: Rev A
3. Variant: BASE
4. BOM Rev & Date: 01 / 2026-11-10
5. Qty Rule: Positions per board

Field-by-Field Specification Table

Field What to Enter Valid Example How to Verify Action If Check Fails
Reference Designators Every individual position (expand ranges like R1-R5) R1, R2 Count listed references; check for duplicates against schematic Fix schematic/PCB sync before editing the spreadsheet
Quantity per Board Exact count matching your stated convention 2 Must equal the designator count under Positions per Board (or 0 for DNP rows under Fitted Qty) Split DNP items or recount designators
Manufacturer Full component maker name YAGEO Match the official component datasheet Replace generic labels with approved maker
Manufacturer Part Number (MPN) Complete ordering code, including all suffixes RC0603FR-0710KL Verify every character against datasheet ordering table Never truncate suffixes; confirm packaging/RoHS codes
Description / Spec Key electrical values for quick human sanity-checks 10 kΩ, ±1%, 0.1 W @ 70 °C, Thick Film Confirm value, tolerance, voltage, and dielectric match MPN Resolve any MPN vs. description mismatch immediately
Package / Footprint Standard case code with unit system + PCB footprint name 0603 Imperial (1608 Metric) Compare datasheet body dimensions against PCB land pattern Update footprint or MPN if pad geometry differs
Fitted Status Whether the part is populated in this variant Fitted or DNP Cross-check against the selected design variant Move DNP positions to their own row
Supply Responsibility Who procures and delivers the component Turnkey (Assembler) or Consigned (Customer) Match against your RFQ/kitting agreement Do not mark consigned parts as DNP
Distributor & SKU (Optional) Supplier catalog code for purchasing convenience DigiKey: 311-10.0KHRCT-ND Confirm the SKU maps 1:1 to the exact MPN Remove or update if SKU points to a different reel/suffix
Approved Alternate Exact pre-approved substitute MPN + scope Vishay CRCW060310K0FKEA (R1, R2) Verify pinout, ratings, and engineering sign-off Remove vague notes like “or equivalent”
Assembly Notes Special mounting, polarity, or handling instructions Hand-solder after reflow; no-clean flux Ensure notes do not contradict Fitted or Supply columns Move structured data into dedicated columns

Why Complete MPN Suffixes Matter

Truncating an MPN breaks automated quoting and risks receiving the wrong package, temperature grade, or reel orientation.

  • In YAGEO’s RC0603FR-0710KL, 0603 is the size, F is ±1% tolerance, R is paper tape reel, 07 is 7-inch reel, 10K is resistance, and L indicates lead-free/RoHS termination.
  • In Texas Instruments’ LM358DR, D specifies the 8-pin SOIC package and R specifies Tape & Reel (whereas P is PDIP through-hole and DGK is VSSOP—completely incompatible footprints).

Exact MPN vs. Specification-Based Passives

Use exact MPNs by default; use specification-based lines only when your assembler explicitly supports generic passives. Some prototype assemblers allow generic resistor/capacitor selection from their house reel library. Even then, “10k” is insufficient—specify value, tolerance, power/voltage rating, dielectric (X7R vs. Y5V), and Imperial/Metric package so circuit margins are protected.

Package Size Trap: Imperial 0603 vs. Metric 0603

Never write 0603 or 0402 without stating the unit system:

  • Imperial 0603 = 0.06″ × 0.03″ (1.6 mm × 0.8 mm, Metric 1608) — standard general-purpose SMD size.
  • Metric 0603 = 0.6 mm × 0.3 mm (Imperial 0201) — ~2.67× shorter per side (~7.1× smaller area); will not fit Imperial 0603 pads.
  • Imperial 0402 = 1.0 mm × 0.5 mm (Metric 1005) vs. Metric 0402 = 0.4 mm × 0.2 mm (Imperial 01005).

When to Group vs. Split Identical Parts

Group identical MPNs onto one row only when every build instruction matches. In KiCad 9.0’s BOM exporter, grouping depends on the selected fields. Always split rows if components share an MPN but differ in:

  • Fitted status: R1, R2 are Fitted, while R3 is DNP.
  • Supply responsibility: Assembler buys C1, customer consigns C2.
  • Approved alternate scope: Alternate approved for R1 pull-up, but not R4 precision divider.

Annotated PCB BOM Example: Read and Check Every Column

Follow how each row below links designator, quantity, identity, status, and supply ownership. (Note: DEMO-BOM-01 is a fictional teaching example built with real manufacturer part numbers.)

Fictional BASE board detail showing fitted R1 and R2 resistors and two empty pads at DNP position R3.
Sample Header: Assembly DEMO-BOM-01 · PCB Rev A · BOM Rev 01 · Variant BASE · Release 2026-11-10
Quantity Convention: Positions per Board (lists all designators, including DNP slots; procurement demand is calculated from Fitted rows only).
References Qty Manufacturer / Complete MPN Description Package Fitted Status Supply Owner
R1, R2 2 YAGEO / RC0603FR-0710KL 10 kΩ, ±1%, 0.1 W @ 70 °C Thick Film Resistor 0603 Imperial (1608 Metric) Fitted Assembler
C1 1 YAGEO / CC0603KRX7R9BB104 100 nF (0.1 µF), ±10%, 50 V, X7R MLCC 0603 Imperial (1608 Metric) Fitted Assembler
U1 1 Texas Instruments / LM358DR Dual Op-Amp, 30 V, 700 kHz GBWP 8-SOIC (D package) Fitted Assembler
J1 1 Samtec / TSW-102-07-G-S 2-Pin THT Header, Single Row 2.54 mm (0.100″) pitch Fitted Customer
R3 1 YAGEO / RC0603FR-0710KL 10 kΩ, ±1% Resistor (unpopulated in BASE) 0603 Imperial (1608 Metric) DNP N/A

Column-by-Column Check Notes:

  1. R1, R2 vs. R3 (Same MPN, Split Rows): R3 uses the same resistor MPN as R1, R2, but stays on its own row because it is DNP in the BASE variant.
  2. C1 (Critical Specs Beyond Capacitance): 100 nF equals 0.1 µF, and choosing 50 V with X7R dielectric provides better margin than low-voltage or Y5V parts—though X7R still experiences DC bias derating, so verify effective capacitance against the part’s DC bias curve at your operating voltage.
  3. U1 (Exact Package Suffix): Keeping DR ensures the assembler quotes the 8-SOIC (D) footprint in Tape & Reel rather than PDIP or VSSOP.
  4. J1 (Consigned + THT): J1 is customer-supplied and through-hole. It remains Fitted (it must be hand- or wave-soldered) and may be absent from an SMD-only placement file.
  5. R3 (DNP Quantity Convention): Under Positions per Board, R3 shows Qty = 1 with Fitted Status = DNP (0 fitted demand). If your assembler’s template uses Fitted Qty per Board, set R3 to 0 or omit it per their variant rules.

Resolve Three Frequent BOM Mix-ups

Two fitted resistor positions and a board batch alongside component reels, stock trays and a purchase order.

1. Manufacturer Part Number (MPN) vs. Distributor SKU vs. Internal PN

An MPN identifies the physical component; a distributor SKU identifies only one vendor’s listing. Never paste a DigiKey, Mouser, or LCSC code into the MPN column. If that distributor runs out of stock, the assembler cannot cross-reference an alternative supplier without the original manufacturer name and MPN. Keep MPN, Distributor SKU, and your Internal Company PN in three separate columns (matching how KiCad’s IPC-2581 exporter separates manufacturer and distributor part fields).

2. Quantity per Board vs. Purchase Quantity (Attrition & Overages)

The BOM quantity column must always equal the per-board design count—never multiply it by your build volume or add attrition inside the BOM.

  • Design demand example: For 100 BASE boards, R1, R2 require 2 × 100 = 200 fitted resistors, while R3 (DNP) requires 0.
  • Why purchase quantity is higher: SMT pick-and-place feeders require empty leader tape (or extra components) to thread into the feeder, alongside mispick attrition and Minimum Order Quantities (MOQ). If you consign parts, confirm the exact feeder leader-tape, overage, and continuous cut-tape requirements with your assembler based on their feeder type, packaging, and build volume.

3. DNP vs. Assembly Variant vs. PCB Revision

DNP is a per-position instruction, a Variant is a build configuration, and a Revision is a controlled design change.

  • DNP (Do Not Populate): The pads exist on the bare PCB, but no component is placed in this build.
  • Assembly Variant: A named build option (e.g., BASE vs. PRO) that toggles Fitted/DNP or swaps an MPN on the same bare PCB.
  • Revision (Rev A → Rev B): A formal change to copper, schematic, or BOM documentation. Always specify both PCB Revision and Assembly Variant in your release header.

Incorrect vs. Correct BOM Rows—and How to Fix Them

Never “fix” a conflicting BOM row by guessing which column is right—always check the schematic and datasheet first.

Highlighted BOM cells enlarged to show a 10-kilohm part number conflicting with a 1-kilohm description.
Broken / Ambiguous Entry Root Risk Corrected Entry / Action Stop & Escalate If…
Description: “10k”, no MPN Assembler cannot verify tolerance, wattage, or package YAGEO / RC0603FR-0710KL (or full agreed spec) STOP Circuit tolerance/wattage is unknown
R1, R2, R3, Qty 2, Fitted Designator count (3) contradicts Qty (2) Split R3 to a DNP row, or update Qty to 3 STOP Schematic doesn’t clarify R3 status
311-10.0KHRCT-ND in MPN Distributor SKU blocks multi-source quoting Move SKU to Distributor SKU; put RC0603FR-0710KL in MPN STOP SKU maps to multiple reel/cut-tape options
RC0603FR-0710KL labeled 1 kΩ MPN is 10 kΩ, description says 1 kΩ (10× error) Verify schematic value, then fix either MPN or description STOP Unclear whether circuit needs 1 kΩ or 10 kΩ
Package: “Small SMD” or “0603” Imperial 0603 vs. Metric 0603 (0201) mismatch 0603 Imperial (1608 Metric) + footprint name STOP Pad dimensions on PCB don’t match part
Alternate: “or equivalent” Uncontrolled substitution risks wrong pinout/dielectric Vishay CRCW060310K0FKEA (R1, R2) or None STOP Engineering hasn’t approved any alternate
Customer-supplied J1 marked DNP Assembler will skip soldering J1 Fitted = Yes; Supply = Customer STOP Kitting responsibility is unconfirmed
Portal import ignores DNP column Automated importer quotes/places DNP parts Remap columns in portal; re-verify preview STOP Portal still shows DNP parts as active

Watch Out for Spreadsheet & CSV Formatting Traps

Opening or saving a BOM in Excel can silently corrupt data before you send it:

  • Date auto-conversion: Part numbers like 10-01 or MAR-04 turn into dates (Oct-01). Format MPN columns as Text before pasting.
  • Stripped leading zeros & scientific notation: 0603 becomes 603; long numeric codes turn into 1.23E+11.
  • Broken .csv columns & symbols: Unquoted commas inside descriptions (10k, 1%, 0603) can shift columns, and encoding mismatches (non-UTF-8 exports or Excel misreading UTF-8) turn Ω or ± into garbled characters (Ω)—use UTF-8 or ASCII units (kOhm, uF, +/-).

Pre-Submission Checklist: Match BOM, Placement File, and Assembly Drawing

Run these 8 checks in order on your final exported files—not inside your CAD tool—before sending the RFQ or production package.

Four illustrated release-check phases: release documents, BOM inspection, assembly-file comparison and export review.
  1. 1. Lock the Release Package: Confirm your release manifest maps the BOM, Gerbers/ODB++, placement file, and assembly drawing to the exact same PCB Revision and Assembly Variant.
  2. 2. Audit Designators & Grouping: Expand any hyphenated ranges (R1-R4), confirm zero duplicate designators, and verify each row’s Qty matches its designator count.
  3. 3. Verify Fitted vs. DNP Counts: Confirm every DNP slot is isolated from Fitted rows and uses the assembler’s expected quantity rule (Positions vs. 0).
  4. 4. Cross-Check MPN, Specs, Lifecycle & Footprint: Confirm every MPN is Active (not NRND/Obsolete), matches its description, and matches the PCB land pattern (especially Imperial vs. Metric chip sizes and exposed thermal pads).
  5. 5. Confirm Supply Ownership & Alternates: Ensure every Fitted row is marked Assembler or Customer, and every alternate names an exact MPN with approved reference scope.
  6. 6. Reconcile BOM vs. Placement File by Scope: Compare expanded Fitted SMD designators in the BOM against the placement file. Verify THT parts, mechanical hardware, and fiducials separately.
  7. 7. Check Polarity & Orientation on the Assembly Drawing: Verify Pin-1 markers, diode/capacitor polarity, and DNP callouts on the assembly drawing match the BOM and placement rotation.
  8. 8. Reopen Exported Files & Inspect Portal Mapping: Open the final .xlsx/.csv in a text editor or spreadsheet to confirm zero truncated MPNs or shifted columns. Inspect online portal previews to verify DNP and Customer Supplied flags mapped cleanly.

For the broader RFQ package, see the PCB assembly quote checklist and PCB DFM checklist.

PCB BOM FAQ

Can I submit a BOM without exact MPNs?

Yes—only if your assembler explicitly supports specification-based selection for generic passives. You must still provide complete electrical and mechanical parameters (value, tolerance, voltage/power rating, dielectric, and Imperial/Metric package) and confirm approval rules. For ICs, connectors, and critical components, always provide the complete MPN.

Should I group identical parts into one row?

Yes, provided their MPN, fitted status, supply responsibility, and approved alternates are identical. List every reference designator on that row and verify the quantity. Split rows immediately if one position is DNP or customer-supplied.

Must DNP parts appear in the BOM?

It depends on your assembler’s template—both methods work if stated explicitly. Keeping DNP rows in the BOM with Fitted Status = DNP (and 0 fitted demand) gives the clearest audit trail. If your workflow omits DNP rows, note that clearly on the assembly drawing and variant sheet.

Does every BOM item need a pick-and-place entry?

No—placement files typically cover fitted SMD components only. Through-hole connectors, mechanical hardware, heatsinks, and DNP parts are often excluded from the P&P export, while fiducials may appear in P&P without being in the BOM. Reconcile designators within the same mounting scope.

No—always put the Manufacturer and complete MPN in text columns. Distributor links break, go out of stock, or point to specific packaging/MOQs. Treat distributor URLs and SKUs as supplemental purchasing references only.

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